Pars Electronics

Features:-
International standard package
Planar passivated chips
Very short recovery time
Soft recovery behaviour

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: as per requirement
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Delivery Time: AS PER REQUIRED
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Delivery Time: AS PER REQUIRED
• Packaging Details: GOOD PACKING

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-
• DC Current Gain − hFE = 20−70 @ IC = 4 Adc
• Collector−Emitter Saturation Voltage − VCE(sat) = 1.1 Vdc (Max) @ IC = 4 Adc
• Excellent Safe Operating Area
• Pb−Free Packages are Available*

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer)
• Delivery Time: As Per Requirement
• Packaging Details: GOOD PACKING

Features • High Safe Operating Area • High DC Current Gain • These Devices are Pb−Free and are RoHS Compliant* • Complementary to MJ15023 (PNP), MJ15025 (PNP)

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

• High collector voltage: VCEO = 230 V (min)
• Complementary to TTA1943
• Recommended for 100-W high-fidelity audio frequency amplifier output stage. 

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

• High collector voltage: VCEO = -230 V (min)
• Complementary to TTC5200
• Recommended for 100-W high-fidelity audio frequency amplifier output stage.

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

This Power MOSFET is the latest development of STMicroelectronics unique “single feature size” strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalance characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Benefits

• Increased ruggedness
• Wide availability from distribution partners
• Industry standard qualification
• High performance in low frequency applications

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: as per requirment
• Packaging Details: good packing

Benefits

• Standard pinout allows for drop in replacement
• High-current carrying capability package
• Industry standard qualification level
• High performance in low frequency applications
• Increased power density

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High Voltage :-  Vcbo =1700v
• Low Saturation Voltage:- Vce(sat) =3V(Max)
• High Speed:- tf(2) = 0.1 us(Typ.)

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-

• Low drain-source ON-resistance: RDS (ON) = 1.0 Ω (typ.)
• High forward transfer admittance:  Yfs = 7.0 S (typ.)
• Low leakage current: IDSS = 100 μA (max) (VDS = 720 V)
• Enhancement model: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)

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• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER RQUIREMENT
• Packaging Details: GOOD PACKING

Features

• UltraFast: Optimized for high operating frequencies 8-40 kHz in hard switching, >200 kHz in resonant mode
• Generation 4 IGBT design provides tighter parameter distribution and higher efficiency than Generation 3
• Industry standard TO-247AC package

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING