Pars Electronics

Features:-

• Superior solution for frequency controlled inverter drives
• UL/CSA Certification with UL1557 E83336
• Operating temperature up to 125 °C (max 150 °C)
• Optimized switching characteristic like softness and reduced switching losses
• Existing packages with higher current capability
• RoHS compliant

Benefits:-

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Applications:-

• High Frequency Switching Application
• Medical Applications
• Motor Drives

Features:-

• High Short Circuit Capability, Self Limiting Short Circuit Current
• Low Switching Losses

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• Superior solution for frequency controlled inverter drives
• UL/CSA Certification with UL1557 E83336
• Operating temperature up to 125°C (max 150°C)
• Optimized switching characteristic like softness and reduced switching losses
• Existing packages with higher current capability
• RoHS compliant

Benefits:

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

APPLICATION:-

General purpose inverters & Servo controls, etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQIRMENT
• Packaging Details: GOOD PACKING

Application:-

• GENERAL PURPOSE INVERTERS, SERVO AMPLIFIERS, POWER SUPPLY

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-

• Low Drive Power
• High Frequency Operation

Applications:-

• AC Motor Control
• Motion/Servo Control

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-

• Low Drive Power
• High Frequency Operation

Applications:-

• AC Motor Control

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• Superior solution for frequency controlled inverter drives
• Existing packages with higher current capability
• RoHS compliant

Benefits:

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Item Code: FF300R06KE3
• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• Low V(cesat)
• Trench IGBT 3
• Package with CTI > 400
• Copper Base Plate
• UL recognised

Benefits:

• High power density for compact inverter designs
• Standardized housing

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

Easy separation of DC and ACOptimized Thermal Resistance Case to Heat SinkHighest Power Density for compact Inverter Designs
Benefits:

Compact ModulesEasy and most reliable assemblyNo Plugs and Cables requiredIdeal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design 

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

High power densityEstablished Econo module conceptIntegrated temperature sensor availableLow stray inductance module design
Benefits:-

Compact module conceptOptimized development cycle time and costConfiguration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: as per requirment
• Packaging Details: good packing

Features:-

• Low Drive Powe
• Discrete Super-Fast Recovery Free-Wheel Diode

Applications:-

• AC Motor Control
• Motion/Servo Control

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• VCE(sat) classified for easy parallel connection 
• High speed switching 
• Voltage drive 
• Low inductance module structure

Applications:-
· Inverter for Motor drive
· AC and DC Servo drive amplifier
· Uninterruptible power supply
· Industrial machines, such as Welding machines

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

APPLICATION:-

• General purpose inverters & Servo controls, etc
• Isolated metal case with screw terminals
• Blocking voltage to 1600 V 
• High surge currents

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Low Drive Power
• High Frequency Operation

Application:-

• AC Motor Control

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

The Board 2s SKYPER® 32PRO R is an adaptor board for the IGBT module SEMiX® 2s (spring contactversion). The board can be customized allowing adaptation and optimization to the used SEMiX® Module.The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on andturn-off speed by variation of RGon and RGoff. Furthermore, it is possible to adjust the monitoring level andblanking time for the DSCP (see Technical Explanations SKYPER® 32PRO R)

Additional Information:

• Item Code: 100AMP1200V
• Pay Mode Terms: T/T (Bank Transfer)
• Delivery Time: as per requirement
• Packaging Details: GOOD PACKING