Pars Electronics

Features:

• Superior solution for frequency controlled inverter drives
• Existing packages with higher current capability
• RoHS compliant

Benefits:

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Item Code: FF300R06KE3
• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:

• Superior solution for frequency controlled inverter drives
• UL/CSA Certification with UL1557 E83336
• Operating temperature up to 125 °C (max 150 °C)
• Optimized switching characteristic like softness and reduced switching losses
• Existing packages with higher current capability

Benefits:

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:

• Superior solution for frequency controlled inverter drives
• UL/CSA Certification with UL1557 E83336
• Operating temperature up to 125°C (max 150°C)
• Optimized switching characteristic like softness and reduced switching losses
• Existing packages with higher current capability
• RoHS compliant

Benefits:

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Applications:-

• High Power Converters
• Motor Drives
• UPS System

Features:-
• Extended Operation Temperature Tv jop
• Low Switching Losses
• Unbeatable Robustness
 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: as per requirement
• Packaging Details: good packing

Features:

• Low V(cesat)
• Trench IGBT 3
• Package with CTI > 400
• Copper Base Plate
• UL recognised

Benefits:

• High power density for compact inverter designs
• Standardized housing

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: as per requirment
• Packaging Details: good packing

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• 1200V Emitter Controlled technology 120 µm chip 
• Soft, fast switching 
• Low reverse recovery charge 
• Small temperature coefficient 
• Qualified according to JEDEC for target applications

Applications:

• SMPS, resonant applications, drives

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design 

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Low switching losses
• Trench IGBT3
• VCEsat with positive temperature coefficient
• Low VCEsat
• Al2O3 Substrate with low thermal resistance
• Compact design
• Solder contact technology
• Rugged mounting due to integrated mounting clamps

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Low stray inductance module design
• High reliability and power density
• Copper base plate for optimized heat spread
• Solderable pins
• Low switching losses
• High switching frequency
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRED
• Packaging Details: GOOD PACKING

Features:-

• Low stray inductance module design
• High reliability and power density
• Copper base plate for optimized heat spread
• Solderable pins
• Low switching losses
• High switching frequency
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• Low stray inductance module design
• High reliability and power density
• Copper base plate for optimized heat spread
• Solderable pins
• Low switching losses
• High switching frequency
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Low stray inductance module design
• High reliability and power density
• Copper base plate for optimized heat spread
• Solderable pins
• Low switching losses
• High switching frequency
• RoHS-compliant moduleS

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER RQUIREMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Easy module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

High power densityEstablished Econo module conceptIntegrated temperature sensor availableLow stray inductance module design
Benefits:-

Compact module conceptOptimized development cycle time and costConfiguration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:-

• Compact module concept
• Optimized development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• High power density
• Established Econo module concept
• Integrated temperature sensor available
• Low stray inductance module design
• RoHS-compliant modules

Benefits:

• Compact module concept
• Optimized customer’s development cycle time and cost
• Configuration flexibility
• Fast, reliable and low cost mounting concept

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

Easy separation of DC and ACOptimized Thermal Resistance Case to Heat SinkHighest Power Density for compact Inverter Designs
Benefits:

Compact ModulesEasy and most reliable assemblyNo Plugs and Cables requiredIdeal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Easy separation of DC and AC
• Optimized Thermal Resistance Case to Heat Sink
• Highest Power Density for compact Inverter Designs

Benefits:-

• Compact Modules
• Easy and most reliable assembly
• No Plugs and Cables required
• Ideal for Low Inductive System Designs

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Superior solution for frequency controlled inverter drives
• UL/CSA Certification with UL1557 E83336
• Operating temperature up to 125 °C (max 150 °C)
• Optimized switching characteristic like softness and reduced switching losses
• Existing packages with higher current capability
• RoHS compliant

Benefits:-

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Applications:-

• High Frequency Switching Application
• Medical Applications
• Motor Drives

Features:-

• High Short Circuit Capability, Self Limiting Short Circuit Current
• Low Switching Losses

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:

• Low switching losses
• Unbeatable robustness
• V CEsat with positive temperature coefficient
• Low VCEsat
• Package with CTI > 400
• High creepage and clearance distances
• Isolated base plate
• Standard housing

Benefits:-

• Flexibility
• Optimal electrical performance
• Highest reliability

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

We deal in all kind's of semiconductor devices like IGBT Modules, IPM Modules, SCR Diode, IC, Capacitor, Make infinion, eupac, semikron, Mistibushi, IXYS,Epcos, Sarda etc 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Application:-

• General purpose inverters & Servo controls, etc

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Low Drive Power
• High Frequency Operation
• Isolated Baseplate for Easy

Applications:-

• AC Motor Control
• Motion/Servo Control

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIRMENT
• Packaging Details: GOOD PACKING

Features:-

• Small temperature dependence of the turn-off switching loss
• Easy to connect in parallel
• Low loss and soft-switching (reduction of EMI noise) 

Applications:-

• General purpose inverter
• AC Servo systems (Drive unit)
• UPS (Uninterruptible Power Supply)

Additional Information:

• Item Code: 1MBI600X-140
• Pay Mode Terms: T/T (Bank Transfer),Other
• Delivery Time: AS PER REQUIREMENT
• Packaging Details: GOOD PACKING

DIP-IPMs are intelligent power modules that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 5th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.

Additional Information:

• Delivery Time: AS PER REQUIRED
• Packaging Details: GOOD PACKING